Specifications
General Specifications
Platform:
Boxed Processor
Market Segment:
Mainstream Desktop
Product Family:
AMD Ryzen™ Processors
Product Line:
AMD Ryzen™ 7 Desktop Processors
Consumer Use:
Yes
Regional Availability:
Global, China, NA, EMEA, APJ, LATAM
Former Codename:
"Cezanne"
Architecture:
"Zen 3"
# of CPU Cores:
8
# of Threads:
16
Max. Boost Clock:
Up to 4.6GHz
Base Clock:
3.7GHz
L1 Cache:
512KB
L2 Cache:
4MB
L3 Cache:
16MB
Default TDP:
65W
AMD Configurable TDP (cTDP):
45-65W
Processor Technology for CPU Cores:
TSMC 7nm FinFET
CPU Compute Die (CCD) Size:
180mm²
Package Die Count:
1
Unlocked for Overclocking:
Yes
CPU Socket:
AM4
Socket Count:
1P
Supporting Chipsets:
X570
X470
X370
B550
B450
B350
A520
CPU Boost Technology:
Precision Boost 2
Instruction Set:
x86-64
Supported Extensions:
AES, AMD-V, AVX, AVX2, FMA3, MMX(+), SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64
Thermal Solution (PIB):
AMD Wraith Stealth
Max. Operating Temperature (Tjmax):
95°C
Launch Date:
4/4/2022
*OS Support:
Windows 10 - 64-Bit Edition
RHEL x86 64-Bit
Ubuntu x86 64-Bit
*Operating System (OS) support will vary by manufacturer.
Connectivity
USB Type-C® Support:
Yes
Native USB 4 (40Gbps) Ports:
0
Native USB 3.2 Gen 2 (10Gbps) Ports:
4
Native USB 3.2 Gen 1 (5Gbps) Ports:
0
Native USB 2.0 (480Mbps) Ports:
0
Native SATA Ports:
2
PCI Express® Version:
PCIe 3.0
Native PCIe® Lanes (Total/Usable):
24 / 20
Additional Usable PCIe Lanes from Motherboard
AMD X570
16x Gen 3
AMD X470
2x Gen 3
AMD X470
8x Gen 2
NVMe Support:
Boot, RAID0, RAID1, RAID10
System Memory Type:
DDR4
Memory Channels:
2
System Memory Subtype:
UDIMM
System Memory Specification:
Up to 3200MT/s
Max Memory Speed:
2x1R DDR4-3200
2x2R DDR4-3200
4x1R DDR4-2933
4x2R DDR4-2667
ECC Support:
No
Graphics Capabilities
Integrated Graphics:
No
Graphics Model:
Discrete Graphics Card Required